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For intermediate and higher volumes, glass wafers, NanoGetter® patterning on device wafers or other wafer diameters please contact us for a customized quote. *There is a one-time tooling charge for all new wafer cap and NanoGetter® mask designs. Tooling charges for the NanoGetter® mask may not apply for eutectic and solder wafer bonding, contact us for discussions on your process and wafer cap design. Customer supplied masks may also reduce the tooling costs.
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