 News & Publications
Gold Silicon Eutectic Wafer Bonding Technology for Vacuum Packaging; University of Michigan/WIMS Poster on the Reliability of Eutectic Vacuum Packaging using Nanogetters®
- October 24, 2006
An all-glass chip-scale MEMS package with variable cavity pressure; Journal of Micromechanics and Microengineering
- October, 2006
Nanogetters® expands its manufacturing infrastructure for high-volume production
- September, 2006
University of Michigan Presents Paper discussing Results of using Nanogetters® at Conference
- June, 2006
Navy Surface Warfare Awarded a Phase I SBIR to ISSYS, Inc. for the Developing an Improved Vaccuum Packaging Process for Advanced Inertial Sensors using NanoGetters®
- August 30, 2005
ISSYS, Inc./NanoGetters® Awarded New Patent for Getter and Hermetic Packaging Method
- August 25, 2005
Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs
Journal of Micromechanics and Microengineering - June 28, 2005
ISSYS Achieves ISO9001:2000 Certification
- December 16, 2004
NanoGetters® presents paper entitled, "Wafer-Level, Low-Cost, High-Vacuum Packaging of MEMS Devices Using NanoGetters®" at the Fall 2004 Meeting of the American Vacuum Society (AVS).
- November 18, 2004
DARPA Awarded Grant to ISSYS for the Commercialization of its Prorietary Vacuum Packaging Technology NanoGetters®
- October, 2004
Reliable Packaging using Nanogetters® and Glass Frit Bonding
- SPIE, Jan. 2004
Chip-Level Vacuum Packaging of Micromachines Using NanoGetters®
- IEEE Transactions on Advanced Packaging, Vol. 26, Aug. 2003
June 11, 2003 ISSYS launches NanoMaterial subsidiary
.... The Ypsilanti, Michigan-based MEMS developer said NanoGetters®, a wholly owned subsidiary, sells the
eponymous technology – thin films of chemically reactive materials that pull air or water vapor out of the
cavity or package.
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